Acer Intel Xeon L5530 processor 2.4 GHz 8 MB L3 Tray

Specifications

Product Description

Performance. Efficiency. Agility. Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing. Dual-core processing Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness. Intel® Core™ microarchitecture Better performance on multiple application types and user environments at a substantially reduce power envelope. Majority of SKUs at 65W Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs. Ultra-dense, ultra low-power SKUs at 40W Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density. 4 MB shared L2 cache Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency. Entire L2 cache can be allocated to one core. 1066 and 1333 MHz system bus Faster system bus speeds than previous generations for increased throughput. Intel® Virtualization Technology New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments. Intel® Extended Memory 64 Technology (Intel® EM64T) Flexibility for 64-bit and 32-bit applications and operating systems. Enhanced Intel® Speedstep™ Technology Helps reduce average system power consumption and potentially improves system acoustics.

Key Features

Acer Intel Xeon L5530. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 45 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm². Processor package size: 42.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

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